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Cooler Master Extreme Fusion X1 Thermal Compound

Cooler Master Extreme Fusion X1 (RG-EFX1-TG15-R1) is a high-performance thermal compound delivering 9.5 W/mK conductivity — more than twice that of standard thermal interface materials. Manufactured in Japan, it is short-circuit proof and suitable for precision electronics.

Overview

The Cooler Master Extreme Fusion X1 (model RG-EFX1-TG15-R1) is a professional-grade thermal compound designed to maximize heat transfer between processors and cooling solutions. Its 9.5 W/mK thermal conductivity surpasses both standard TIM and silver-based compounds, while its short-circuit-proof composition makes it safe for all component types. The compound is produced in Japan for consistent purity and performance.

Key Features

  • 9.5 W/mK thermal conductivity — over twice the output of standard thermal interface materials
  • Exceeds silver-based TIM in heat dissipation benchmarks
  • Short-circuit-proof: no electrical risk if paste contacts circuit traces
  • Manufactured in Japan for premium quality assurance

Specifications

  • Model: RG-EFX1-TG15-R1
  • Thermal Conductivity: 9.5 W/mK
  • Color: Silver
  • Country of Origin: Japan
  • Short Circuit Proof: Yes

Why buy from Procure.ae

Procure.ae is the UAE and GCC region's trusted partner for bulk and institutional IT procurement. We stock Cooler Master thermal products and offer fast local delivery, dedicated support, and volume pricing. Contact us or request a quote for multi-unit orders.

FAQ

What does short-circuit proof mean for a thermal compound?
A short-circuit-proof compound is electrically non-conductive, so if any paste spreads beyond the CPU heat spreader onto surrounding board components, it will not cause a short circuit or electrical fault.

Can Extreme Fusion X1 be used on both CPUs and GPUs?
Yes. The compound is suitable for any heat-generating chip that requires a thermal interface material, including desktop CPUs, laptop CPUs, and discrete graphics processors.

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