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Cooler Master Extreme Fusion X1 Thermal Paste

Cooler Master Extreme Fusion X1 is a professional thermal compound with 9.5 W/mK thermal conductivity and a specific gravity of 2.6, manufactured in Japan. Its short-circuit-proof formula and low thermal impedance make it an ideal choice for high-performance PC builds.

Overview

The Cooler Master Extreme Fusion X1 is a high-grade thermal compound engineered for superior heat transfer between a CPU or GPU and its heatsink. With a thermal conductivity of 9.5 W/mK and a specific gravity of 2.6, it outperforms conventional and silver-based thermal interface materials. Manufactured in Japan to exacting quality standards, it is both safe and short-circuit proof.

Key Features

  • Ultra-high thermal conductivity of 9.5 W/mK — more than twice the performance of standard TIM
  • Outperforms silver-based thermal compounds for effective heat dissipation
  • Short-circuit-proof formulation: safe to apply around sensitive components
  • Low thermal impedance (4.15 °C·cm²/W) for efficient heat transfer
  • Manufactured in Japan for consistent product quality

Specifications

  • Model: RG-EFX1-TG15-R1
  • Thermal Conductivity: 9.5 W/mK
  • Specific Gravity: 2.6
  • Volume Resistivity: 1.5
  • Thermal Impedance: 4.15 °C·cm²/W
  • Color: Gray
  • Country of Origin: Japan

Why buy from Procure.ae

Procure.ae supports institutional and bulk procurement across the UAE and GCC. We offer competitive pricing, dedicated account management, and reliable local delivery for IT and infrastructure projects. Request a quote directly through our platform for volume orders.

FAQ

Is Extreme Fusion X1 safe to apply near circuit boards?
Yes. Its short-circuit-proof formulation means accidental contact with PCB traces or capacitors will not cause electrical damage, making it safer than metallic-compound alternatives.

How does 9.5 W/mK compare to standard thermal paste?
Most standard thermal pastes rate below 4 W/mK. At 9.5 W/mK, the Extreme Fusion X1 conducts heat more than twice as effectively, reducing CPU temperatures under sustained load.

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