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Fluke Xlens Macro3 Close-Up Lens for Thermal Cameras

The Fluke Xlens Macro3 is a 0.5x close-up macro lens compatible with Fluke TiX1000, TiX660, and TiX640 thermal cameras, delivering a 35.1 x 26.5 mm field of view at 35 um pixel pitch for precision inspection of PCBs, semiconductor substrates, and small components.

Overview

The Fluke Xlens/Macro3 is a 0.5x close-up macro lens accessory for Fluke TiX1000, TiX660, and TiX640 thermal imaging cameras. By significantly reducing minimum focus distance and increasing spatial resolution, it enables detailed thermal inspection of extremely small targets — including PCB solder joints, semiconductor substrates, and microelectronic seals — in research and development environments.

Key Features

  • 0.5x magnification for detailed close-up thermal imaging
  • 35.1 x 26.5 mm field of view for precise targeting of small subjects
  • 35 um pixel pitch for enhanced spatial resolution
  • Compatible with Fluke TiX1000, TiX660, and TiX640 thermal cameras
  • Ideal for PCB heat dissipation analysis, semiconductor inspection, and R&D applications

Specifications

  • Model: Fluke Xlens/Macro3
  • Type: Close-Up Macro Lens
  • Magnification: 0.5x
  • Field of View: 35.1 x 26.5 mm
  • Pixel Pitch: 35 um
  • Compatible Models: Fluke TiX1000, TiX660, TiX640
  • Color: Black

Why buy from Procure.ae

Procure.ae supplies genuine Fluke thermal imaging accessories to research institutions, electronics manufacturers, and industrial facilities across the UAE and GCC. This product is available on a request-a-quote basis — contact our team for pricing, availability, and bulk procurement options.

FAQ

Q: Which Fluke cameras is this lens compatible with?
A: The Xlens/Macro3 is compatible with Fluke TiX1000, TiX660, and TiX640 thermal cameras only. Verify compatibility before ordering to ensure it fits your specific camera model.

Q: What applications is this lens best suited for?
A: It is designed for R&D work requiring close-up thermal analysis of small targets, including PCB heat dissipation testing, semiconductor substrate inspection, and seal integrity checks.

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